Touch display panel

ABSTRACT

A touch display panel includes an array substrate and an opposite substrate disposed opposite to the array substrate. The opposite substrate includes a first base substrate and a high-resistance film material layer which is disposed on the first base substrate, and a square resistance of the high-resistance film material layer is larger than or equal to 107 Ω/□ and is less than or equal to 1012 Ω/□.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Chinese Application No.201510375783.6, filed Jun. 30, 2015, which is herein incorporated byreference in its entirety.

TECHNICAL FIELD

The present disclosure relates to the field of liquid crystal displaytechnologies and, in particular, to a touch display panel.

BACKGROUND

FIG. 1 is a schematic diagram showing the structure of a display panelin the related art within the field of liquid crystal displaytechnologies. As shown in FIG. 1, an existing display panel includes anupper substrate and a lower substrate, i.e., an array substrate 11 and acolor filter substrate 12. Additionally, in order to prevent an externalelectric field from influencing the displaying of the display panel, ashielding film, for example an Indium-Tin-Oxide (ITO) film 13 with athickness of about 200 Å, can be deposited on the outside of the colorfilter substrate 12.

Additionally, after the display panel is assembled, the ITO film 13 iselectrically connected with a grounding piece 15 on the array substratevia conductive silver paste 14, so that the ITO film 13 is groundedduring the displaying of the display panel, to shield the displaying ofthe display panel from the external influence.

With the application of touch technologies, touch elements are generallyintegrated into the display panel at present and, more particularly,onto the color filter substrate or the array substrate, to form a touchdisplay panel. The square resistance of the typical ITO film used in therelated art is about 300Ω/□, thus the ITO film will shield off not onlythe influence of the environment on the displaying of the display panel,but also a touch signal from the environment, thereby influencing thetouch sensing performance of the touch display panel.

SUMMARY

The present disclosure provides a touch display panel to avoid theinfluence of a shielding film on the touch sensing performance of thetouch display panel.

The disclosure provides a touch display panel, which includes an arraysubstrate and an opposite substrate disposed opposite to the arraysubstrate, where the opposite substrate includes a first base substrateand a high-resistance film material layer which is disposed on the firstbase substrate, and the square resistance of the high-resistance filmmaterial layer is larger than or equal to 10⁷Ω/□ and is less than orequal to 10¹²Ω/□.

In the touch display panel, according to embodiments of the disclosure,the opposite substrate includes the first base substrate, on which thehigh-resistance film material layer with a square resistance larger thanor equal to 10⁷Ω/□ and less than or equal to 10¹²Ω/□ is disposed. Byusing such high-resistance film material layer, the generated staticelectricity such as charges generated due to a high voltage (forexample, at or above the level of kilovolt (KV)) may be discharged viathe high-resistance film material layer for the purpose of releasing thestatic electricity. However, during touch detection, the high-resistancefilm material layer will not release charges accumulated due to a touchby a finger and the like, that is, the high-resistance film materiallayer has a weak shielding effect on the charge signal generated due tothe touch by the finger and the like, without influencing the touchsensing performance of the touch display panel.

While multiple embodiments are disclosed, still other embodiments of thedisclosure will become apparent to those skilled in the art from thefollowing detailed description, which shows and describes illustrativeembodiments of the disclosure. Accordingly, the drawings and detaileddescription are to be regarded as illustrative in nature and notrestrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in theembodiments of the disclosure or in the related art, the accompanyingdrawings for the description of the embodiments or the related art willbe introduced briefly below. The accompanying drawings for thedescription below illustrate some embodiments of the disclosure, butother drawings may be obtained in light of these accompanying drawings.

FIG. 1 is a schematic diagram showing the structure of a display panelin the related art;

FIG. 2A is a schematic sectional view showing the structure of a touchdisplay panel, according to embodiments of the disclosure;

FIG. 2B is a schematic perspective view showing the structure of thetouch display panel, according to embodiments of the disclosure;

FIG. 3A is a schematic top view of the touch display panel, according toembodiments of the disclosure;

FIG. 3B is another schematic top view of the touch display panel,according to embodiments of the disclosure;

FIG. 3C is still another schematic top view of the touch display panel,according to embodiments of the disclosure;

FIG. 3D is yet another schematic top view of the touch display panel,according to embodiments of the disclosure;

FIG. 4A is a schematic sectional view showing the structure of a touchdisplay panel, according to embodiments of the disclosure;

FIG. 4B is a schematic top view of the touch display panel, according toembodiments of the disclosure;

FIG. 4C is a schematic top view of the touch display panel, according toembodiments of the disclosure;

FIG. 5 is a schematic top view of an array substrate, according toembodiments of the disclosure;

FIG. 6A is a first schematic sectional view of an array substrate,according to embodiments of the disclosure;

FIG. 6B is a second schematic sectional view of the array substrate,according to embodiments of the disclosure;

FIG. 6C is a third schematic sectional view of the array substrate,according to embodiments of the disclosure;

FIG. 7 is a schematic diagram showing the structure of a touch displaypanel, according to embodiments of the disclosure;

FIG. 8A is a schematic diagram showing the structure of a black matrix,according to embodiments of the disclosure; and

FIG. 8B is a schematic diagram showing the arrangement of a pixel regionon the black matrix, according to embodiments of the disclosure.

While the disclosure is amenable to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and are described in detail below. Theintention, however, is not to limit the disclosure to the particularembodiments described. On the contrary, the disclosure is intended tocover all modifications, equivalents, and alternatives falling withinthe scope of the disclosure as defined by the appended claims.

DETAILED DESCRIPTION

In order to make the objects, technical solutions and advantages of thedisclosure more clear, the technical solution of the disclosure will beclearly and fully described by the embodiments in conjunction with theaccompanying drawings for the embodiments of the disclosure. Theembodiments described are merely a part of rather than all of thepossible embodiments of the disclosure. Other embodiments based on thedescribed embodiments of the disclosure pertain to the protection scopeof the disclosure.

FIG. 2A is a schematic diagram showing the structure of a touch displaypanel, according to embodiments of the disclosure. The touch displaypanel includes an array substrate 22 and an opposite substrate 21disposed opposite to the array substrate 22. The opposite substrate 21includes a first base substrate 23 and a high-resistance film materiallayer 24, which is disposed on the first base substrate 23 and has asquare resistance larger than or equal to 10⁷Ω/□ and less than or equalto 10¹²Ω/□.

As such, in the touch display panel, according to embodiments of thedisclosure, the high-resistance film material layer is disposed on thefirst base substrate of the opposite substrate, and the squareresistance of the high-resistance film material layer is larger than orequal to 10⁷Ω/□ and is less than or equal to 10¹²Ω/□. By using suchhigh-resistance film material layer, the generated static electricitysuch as charges generated due to a high voltage (for example, at orabove the level of kilovolt) may be discharged via the high-resistancefilm material layer for the purpose of releasing the static electricity.However, during touch detection, the high-resistance film material layerwill not release charges accumulated due to a touch by a finger and thelike, that is, the high-resistance film material layer has a weakshielding effect on the charge signal generated due to the touch by thefinger and the like, without influencing the touch sensing performanceof the touch display panel.

FIG. 2B is a schematic sectional view showing the structure of the touchdisplay panel, according to embodiments of the disclosure. The arraysubstrate includes a second base substrate 25, and a common electrodelayer 26 and a grounding piece 27 that are disposed on the second basesubstrate 25. The high-resistance film material layer 24 on the firstbase substrate 21 is electrically connected with the common electrodelayer 26, or is grounded (that is, the high-resistance film materiallayer 24 is electrically connected with the grounding piece 27). Theemployment of the above technical solutions allows that: the generatedstatic electricity such as charges generated due to a high voltage (forexample, at or above the level of kilovolt) can be discharged via thehigh-resistance film material layer for the purpose of releasing thestatic electricity.

Further, in the embodiments of the disclosure, a first conductive line28 is provided between the first base substrate 23 and the second basesubstrate 25, so that the high-resistance film material layer 24 iselectrically connected with the common electrode layer 26 or is groundedvia the first conductive line 28.

The first conductive line 28 in the above embodiments may be implementedin two manners. According to one of the two manners, referring again toFIG. 2A, a perimeter sealant 31 is disposed between the oppositesubstrate 21 and the array substrate 22 in the touch display panel, andat least a region of the perimeter sealant 31 is conductive to form thefirst conductive line 28. For example, conductive metal balls are dopedin the perimeter sealant to form the conductive region in the perimetersealant.

FIG. 3A is a schematic top view of the touch display panel, according toembodiments of the disclosure. The perimeter sealant 31 has aframe-shaped structure, and at least one side edge and/or at least onecorner region of the perimeter sealant 31 is configured as conductive.As shown in FIG. 3A, conductive metal balls 281, for example conductivecopper balls, are doped at three side edges of the perimeter sealant 31to form the first conductive line 28 in the perimeter sealant 31.Alternatively, as shown in FIG. 3B, conductive metal balls 281, forexample conductive copper balls, are doped in two corner regions of theperimeter sealant 31, so that the perimeter sealant becomes conductiveto form the first conductive line 28 therein.

As shown in both FIG. 3A and FIG. 3B, a single perimeter sealant 31 isdisposed, and conductive metal balls are doped in the perimeter sealant31 to form the first conductive line. Alternatively, as shown in FIG. 3Cand FIG. 3D, a nonconductive first perimeter sealant 311 withoutconductive metal balls is disposed between the opposite substrate andthe array substrate, and a second perimeter sealant 312 containingconductive metal balls 281 is disposed at the outside of the firstperimeter sealant 311, that is, beside at least one side edge and/or atleast one corner region of the first perimeter sealant 311. FIG. 3Cshows a second perimeter sealant 312 disposed beside one side edge ofthe first perimeter sealant 311, and FIG. 3D shows a second perimetersealant 312 disposed beside two corner regions of the first perimetersealant 311.

Unlike the above embodiments in which conductive metal balls are dopedin the perimeter sealant to form the first conductive line, embodimentsof the disclosure further provide the other of the two manners ofimplementing the first conductive line. Referring to FIG. 4A, aperimeter sealant 31 is disposed between the opposite substrate 21 andthe array substrate 22, and conductive silver paste 32 is disposed asthe first conductive line 28 on the outside of the perimeter sealant 31.Moreover, in embodiments, the conductive silver paste 32, rather thanthe perimeter sealant 31, is configured for an electrical connection,thus the perimeter sealant 31 may be formed of a nonconductive material.

Additionally, in the case of the other of the two manners, the perimetersealant 31 may also have a frame-shaped structure, and the conductivesilver paste 32 is disposed on the outside of at least one side edgeand/or at least one corner region of the perimeter sealant 31. Forexample, as shown in FIG. 4B, the conductive silver paste 32 is disposedbeside one side edge of the perimeter sealant 31; and as shown in FIG.4C, the conductive silver paste 32 is disposed beside two corner regionsof the perimeter sealant 31.

In the above embodiments of the disclosure, the first conductive line 28may be formed in various manners, and may be disposed at differentlocations. In some embodiments, the particular location of the firstconductive line is selected according to the specific structure of thearray substrate. For example, as shown in FIG. 5 which is a schematictop view of an array substrate, according to embodiments of thedisclosure, the second base substrate 25 includes a display region 41and a non-display region 42 around the display region 41, where drivesignal circuits 43 are disposed in the non-display region 42 of thesecond base substrate 25, data lines 44 and scan lines 45 are disposedin the display region 41 of the second base substrate 25, and the datalines 44 and/or the scan lines 45 are electrically connected with thedrive signal circuits 43 via bridge structures (i.e. bypass structures)46 located in the non-display region 42. Depending on manufacturingprocesses, the bridge structures 46 may be exposed as the uppermostlayer of the array substrate, or an insulating layer may be furtherdisposed above the bridge structure 46 along a light transmissiondirection of the display panel.

When the bridge structures 46 are exposed as the uppermost layer of thearray substrate, the first conductive line is required to bypass thebridge structures 46, that is, a projection of the first conductive lineonto the second base substrate 25 is required not to overlap projectionsof the drive signal circuits 43 onto the second base substrate 25, sothat the first conductive line is insulated from the bridge structures.When the first conductive line 28 is implemented in the above-describedtwo manners, according to embodiments of the disclosure, i.e. when theconductive metal balls are doped in the perimeter sealant 31 at at leastone side edge and/or at least one corner region of the perimeter sealant31 to form the first conductive line 28, or the conductive silver paste32 is disposed as the first conductive line 28 on the outside of atleast one side edge and/or at least one corner region of the perimetersealant 31, the first conductive line can bypass the bridge structureseffectively.

The array substrate is manufactured by six masking processes. As shownin FIG. 6A which is a schematic sectional view of an array substrate,according to embodiments of the disclosure, the array substrate includesa first base substrate 25, a first metal layer 251 and a second metallayer 252. The drive signal circuit 43 is located in the first metallayer 251, while the data lines 44 or scan lines 45 are located in thesecond metal layer 252 and electrically connected with the drive signalcircuit 43 via the bridge structures 46, in this case, the bridgestructures 46 are exposed as the uppermost layer of the array substrate.Referring to the above embodiments, if disposed on the oppositesubstrate or the array substrate, the perimeter sealant 31 or theconductive silver paste 32 tends to be in contact and electricallyconnected with the bridge structures 46. In this case, the projection ofthe first conductive line 28 onto the second base substrate 25 shall notoverlap the projection of the drive signal circuit 43 onto the secondbase substrate 25, so that the first conductive line 28 is insulatedfrom the bridge structures 46. In embodiments, the bridge structures 46may be located on the same layer as pixel electrodes on the arraysubstrate, that is, the bridge structures 46 and the pixel electrodesmay be formed in the same one manufacturing process. Herein, the bridgestructures 46 may be formed of Indium-Tin-Oxide (ITO).

Or, in the case that an insulating layer 47 is disposed above the bridgestructures 46 in the light transmission direction, referring to theabove embodiments, the projections of the first conductive lines 28 ontothe second base substrate 25 may at least partially overlap theprojections of the drive signal circuits 43 onto the second basesubstrate 25. For example, for an array substrate with an embedded touchsensing function manufactured by eight masking processes, as shown inFIG. 6B which is a schematic sectional view of the array substrate,according to embodiments of the disclosure, the drive signal circuit 43is located in the first metal layer 251, while the data lines 44 or scanlines 45 are located in the second metal layer 252 and are electricallyconnected with the drive signal circuit 43 via the bridge structures 46.Further, an insulating layer 47 is disposed above the bridge structures46. In this case, because the bridge structures 46 are covered by theinsulating layer 47 thereon, the possible electrical connection betweenthe first conductive line 28 and the bridge structures 46 is avoided nomatter where the first conductive line 28 is disposed, either in thecase that the first conductive line 28 is formed by the perimetersealant 31 doped with conductive metal balls or by the conductive silverpaste 32, according to the above embodiments of the disclosure. Inembodiments, the bridge structure 46 may be located on the same layer asthe pixel electrodes on the array substrate, that is, the bridgestructure 46 and the pixel electrodes may be formed in the same onemanufacturing process. Herein, the bridge structure 46 may be formed ofITO.

In embodiments of the disclosure, the drive signal circuit 43 isconnected with the data lines 44, to supply image display signals to therespective pixel units via the data lines. Alternatively, the drivesignal circuit 43 is connected with the scan lines 45 via shiftregisters, and the drive signal circuit 43 is configured to output oneor more of a clock signal, a high level signal, a low level signal and ascan triggering signal to the shift registers, which in turn generatescan signals according to the signal inputted thereto and output thegenerated scan signals to the respective scan lines 45.

In embodiments of the disclosure, in order to electrically connect thehigh-resistance film material layer on the opposite substrate with thecommon electrode layer and the grounding piece on the array substrate, afirst conductive line 28 is disposed between the opposite substrate andthe array substrate. Further, referring to the FIGS. 3A, 3B, 3C, 3D, 4Band 4C, a second conductive line 29 is disposed on the array substrate,and a first end of the second conductive line 29 is electricallyconnected with one end of the first conductive line 28, while a secondend thereof is electrically connected with the common electrode layer 26or is grounded. Here, the other end of the first conductive line 28 isconnected with the high-resistance film material layer on the oppositesubstrate. When grounded, the second end of the second conductive line29 is electrically connected with the grounding piece 27.

FIG. 6C is a schematic sectional view of the array substrate, accordingto embodiments of the disclosure. In addition to the structure in theexample shown in FIG. 6B, a common electrode layer 26 and a secondconductive line 29 are further disposed above the insulating layer inembodiments, and if the second end of the second conductive line 29 iselectrically connected with the common electrode layer 26, the secondconductive line 29 functions as a common voltage signal line. Further,in embodiments shown in the above FIG. 6B, the common electrode layer 26is located on a side of the insulating layer 47 that is away from thesecond base substrate 25, and is located on the same layer as the commonvoltage signal line.

In the array substrate with an embedded touch sensing function,according to embodiments of the disclosure, referring to FIG. 6C, thecommon electrode layer 26 may include a plurality of common electrodeblocks 261 which can be reused as touch electrodes. The common electrodeblocks 261 which are operable as touch electrodes can be used for both adisplay function and the touch sensing function, according toembodiments. During a display phase, a common voltage signal is appliedto the common electrode blocks 261, while during a touch phase, touchdriving signals are applied to the common electrode blocks 261 operatingas touch electrodes for touch detection. As such, the reuse of thecommon electrode blocks 261 as the touch electrodes eliminates theprovision of an additional touch electrode layer, thus effectivelyreducing the thickness of the array substrate and the whole touchdisplay panel.

In embodiments of the disclosure, in order to improve the connectionbetween the high-resistance film material layer on the oppositesubstrate and the first conductive line as well as the connectionbetween the first conductive line and the second conductive line,referring to FIG. 7 which is a schematic view showing the structure of atouch display panel, according to embodiments of the disclosure, a firstbonding pad 51 is further disposed on the first base substrate 23,and/or a second bonding pad 52 is disposed on the second base substrate25. The high-resistance film material layer 24 on the first basesubstrate 23 is electrically connected with the first conductive line 28via the first bonding pad 51, and the first conductive line 28 iselectrically connected with the second conductive line 29 via the secondbonding pad 52.

Further, referring to FIG. 2B, in embodiments of the disclosure, thetouch display panel further includes a flexible circuit board 53, andthe high-resistance film material layer 24 and the common electrodelayer 26 are both electrically connected with a common electrode signalterminal of the flexible circuit board 53. As such, during thedisplaying of the touch display panel, a common voltage signal isapplied to the common electrode layer 26, and hence the high-resistancefilm material layer 24 is also applied with the common voltage signalsimultaneously, thus shielding off the influence of an outer electricfield on the displaying of the touch display panel, and improving thereliability of discharging the static electricity from the touch displaypanel, meanwhile, the influence of the high-resistance film materiallayer 24 on the touch detection signal during the touch phase isinsignificant.

FIG. 8A is a schematic diagram showing a structure of a black matrix,according to embodiments of the disclosure. In embodiments of thedisclosure, the high-resistance film material layer is embodied as ablack matrix 241 doped with carbon powder on the opposite substrate 21,and the square resistance of the high-resistance film material layer isequal to the equivalent square resistance of the black matrix 241. Inembodiments of the disclosure, the black matrix has a grid structure,and the square resistance of the black matrix with the grid structuremay be equivalently calculated as a square resistance of an equivalentlayer without openings, i.e., the equivalent square resistance. Inembodiments, by doping an amount of carbon powder in the black matrix241, the equivalent square resistance of the black matrix 241 isadjusted to be larger than or equal to 10⁷Ω/□ and less than or equal to10¹²Ω/□.

In embodiments of the disclosure, the high-resistance film materiallayer 24 is formed by the black matrix, so that the dedicatedhigh-resistance film material layer on the opposite substrate iseliminated, so that the existing process for manufacturing the oppositesubstrate is applicable in the embodiment, thus saving costs.

In embodiments of the disclosure where the high-resistance film materiallayer is formed by a black matrix, the doping of the carbon powder intothe black matrix changes not only the square resistance of the blackmatrix, but also the optical density of the black matrix which influencethe shading effect of the black matrix, and the optical density of theblack matrix is larger than or equal to 3 in the embodiment, to ensure agood shading effect of the black matrix. However, in embodiments of thedisclosure, by controlling the content of the carbon powder in the blackmatrix and the thickness of the black matrix, the optical density of theblack matrix is adjusted to be larger than or equal to 3, and theequivalent square resistance of the black matrix is larger than or equalto 10⁷Ω/□ and less than or equal to 10¹²Ω/□.

The square resistance R_(Π) and the optical density

of the black matrix may be derived as follows.

The optical density

of the black matrix is calculated as

=I g(1/T), where T represents light transmissivity of the black matrix.

Generally, the square resistance R_(Π) of the black matrix varies withthe content of carbon powder, that is, when the content of carbon powderis increased, the resistivity ρ of the black matrix is lowered. If thethickness of the black matrix is 1 μm, the square resistance R_(Π) ofthe black matrix is equal to the resistivity ρ of the black matrix, andthe value of the optical density

of the black matrix is equal to an optical density s corresponding to aunit thickness of the black matrix.

For example, given a sample 1 of the black matrix and a sample 2 of theblack matrix, where the content of carbon powder doped in the sample 2is lower than the content of carbon powder doped in the sample 1, thusthe sample 2 has a higher resistivity ρ than the sample 1, and the valueof the optical density s of the sample 2 corresponding to the unitthickness is smaller than the sample 1. The related parameters of thesamples 1 and 2 meet relationships below:

ρ₂=mρ₁, that is, the resistivity ρ₂ of the sample 2 is m times theresistivity ρ₁ of the sample 1;

${S_{2} = {\frac{1}{n}S_{1}}},$that is, the value S₁ of the optical density of the sample 1 per unitthickness is N times the value S₂ of the optical density of the sample 2per unit thickness;

d₂=α*d₁, that is, the thickness d₂ of the sample 2 is α times thethickness d₁ of the sample 1; and

R_(Π2)=β·R_(Π1), that is, the square resistance R_(Π2) of the sample 2is β times the square resistance R_(Π1) of the sample 1;

where, m, n, α and β are all larger than 1.

Additionally, it may be known from the Lambert Beer Law that, theoptical density

of the black matrix is proportional to the optical density s of theblack matrix per unit thickness, that is,

=s*d where d represents the thickness of the black matrix.

The square resistance R_(Π2) of the sample 2 is given as

$R_{\Pi 2} = {\frac{\rho_{2}}{d_{2}} = {\frac{m*\rho_{1}}{\alpha*d_{1}} = {\frac{m}{\alpha}{R_{\Pi 1}.}}}}$

The value of the optical density OD₂ of the sample 2 is given as

2 = S 2 * d 2 = 1 n ⁢ S 1 * α ⁢ ⁢ d 1 = α n ⁢ 1 .

According to a formula

{ R Π2 = β * R Π1 2 > 1 ,it may further be obtained that

$\left\{ {\begin{matrix}{\beta = {m/\alpha}} \\{\alpha > n}\end{matrix}.} \right.$

Thus it may be seen that, if the resistivity ρ₂ of the sample 2 is mtimes the resistivity ρ₁ of the sample 1, and the value S₁ of theoptical density of the sample 1 per unit thickness is n times the valueS₂ of the optical density of the sample 2 per unit thickness, then,

when the thickness d₂ of the sample 2 is α times the thickness d₁ of thesample 1, the square resistance R_(Π)of the sample 2 is ml α times thesquare resistance R_(Π), of the sample 1; and when α>n , it may be metthat the optical density of the sample 2 is larger than the opticaldensity of the sample 1.

For example, samples 1 and 2 that meet specifications below are given.

Value S of Square Value of optical density resistance optical per unitthickness Value Thickness density Sample (/μm) (Ω/□) (μm) of sampleSample 1 3.8 10⁷  1.0 3.8 Sample 2 3.2 10¹⁵ 1.3 4.16

It may be known from the above parameters that,

${m = {\frac{\rho_{2}}{\rho_{1}} = 10^{8}}},$n=S₁/S₂=1.2, and β=m/α=10⁸/α.

If α>1. 2, then

>

; at the same time, the square resistance value of the sample 2 isobtained as 10¹⁵/α(Ω/□), so that the square resistance value can matchthe optical density value by adjusting the thickness of the sample; insome embodiments, the thickness of the black matrix is in a range from0.5 μm to 3.5 μm.

Additionally, in embodiments, the high-resistance film material layer isformed by a black matrix doped with carbon powder. Due to the presenceof openings in the black matrix which has a grid structure, a lighttransmission region is disposed in each pixel region. Referring to FIGS.8A and 8B, taking one pixel region on the top left corner of the blackmatrix as an example, since each pixel region may be equivalent to onerectangular structure with an equivalent length L, an equivalent widthw, an equivalent thickness d, and resistivity ρ, if the black matrix isformed as the whole layer free of openings, the equivalent resistance ofthe black matrix corresponding to the rectangular structure,

${R = {{\rho\frac{L}{d*W}} = {R_{\Pi\; e\; 1}*\frac{L}{W}}}},$where R_(Πe1) denotes the equivalent square resistance thereof.

FIG. 8B is a schematic diagram showing the structure of one pixel regionin the black matrix, according to embodiments of the disclosure. A lighttransmission region is disposed in the pixel region, and is equivalentto a rectangular structure with an equivalent length L_(h1) and anequivalent width w_(h).

Additionally, the pixel region may be divided into four parts,including: a first part, the length, width, thickness and resistance ofwhich are respectively L_(v1,)w, d_(e2) and R_(v1); a second part, thelength, width, thickness and resistance of which are respectively L₂, w,d_(e2) and R_(v2); a third part, the length, width, thickness andresistance of which are respectively L_(h1), W_(h1), d_(e2) and R_(h1);and a fourth part, the length, width, thickness and resistance of whichare respectively L_(h2), w_(h2), d_(e2) and R_(h2), where L₁=L_(h2)

Thus, in the pixel region provided with the light transmission region,the actual square resistance of the black matrix is denoted by R_(Πe2),and the resistance of the black matrix is obtained as

${R_{mesh} = {\frac{R_{h\; 1}*R_{h\; 2}}{R_{h\; 1} + R_{h\; 2}} + R_{v\; 1} + R_{v\; 2}}},$

where, the values of R_(h1), , R_(h2), R_(v1) and R_(v2) may becalculated according to the above formulae, and it may further obtainedby calculation that:

${R_{mesh} = {{R_{\Pi\; e\; 2}*\left( {\frac{L_{h\; 1}*L_{h\; 2}}{{L_{h\; 1}W_{h\; 2}} + {L_{h\; 2}W_{h\; 1}}} + \frac{l_{v\; 1}}{W_{v\; 1}} + \frac{l_{v\; 2}}{W_{v\; 2}}} \right)} = {{{R_{\Pi\; e\; 2}*{\left( {\frac{l_{h\; 1}}{W_{h\; 2} + W_{h\; 1}} + \frac{L - l_{h\; 1}}{W}} \right).\mspace{20mu}{Given}}\mspace{14mu}{that}\mspace{14mu} W} - W_{h}} = {W_{h\; 2} + W_{h\; 1}}}}},\mspace{20mu}{R_{mesh} = {R_{\Pi\; e\; 2}*{\left( {\frac{l_{h\; 1}}{W - W_{h}} + \frac{L - l_{h\; 1}}{W}} \right).}}}$

If R=R_(hesh) , the actual square resistance and the equivalent squareresistance of the black matrix meet the formula below:

${R_{\Pi\; e\; 1}*\frac{L}{W}} = {R_{\Pi\; e\; 2}*{\left( {\frac{l_{h\; 1}}{W - W_{h}} + \frac{L - l_{h\; 1}}{W}} \right).}}$

If the content of carbon powder in the black matrix is constant and theresistivity is the same, the preceding formula may be further simplifiedas:

${\frac{1}{d_{2}}*\left( {\frac{l_{h\; 1}}{W - W_{h}} + \frac{L - l_{h\; 1}}{W}} \right)} = {\frac{1}{d_{1}}*\frac{L}{W}}$

Therefore, by only adjusting the thickness of the black matrix, it maybe obtained thatR=R_(hesh.)

In the touch display pane!, according to embodiments of the disclosure,the opposite substrate includes the first base substrate, on which thehigh-resistance film material layer with a square resistance larger thanor equal to 10⁷Ω/□ and less than or equal to 10¹²Ω/□ is disposed. Byusing such high-resistance film material layer, the generated staticelectricity such as charges generated due to a high voltage (forexample, at or above the level of kilovolt) may be discharged via thehigh-resistance film material layer for the purpose of releasing thestatic electricity. However, during touch detection, the high-resistancefilm material layer will not release charges accumulated due to a touchby a finger and the like, that is, the high-resistance film materiallayer has a weak shielding effect on the charge signal generated due tothe touch by the finger and the like, without influencing the touchsensing performance of the touch display panel. In some embodiments, thehigh-resistance film material layer may be formed by a black matrix onthe opposite substrate, so that the technical solution of the disclosuremay be realized without changing the manufacturing process of theopposite substrate.

In embodiments of the disclosure, the touch sensing performance of thetouch display panel that employs the high-resistance film material layeris verified by experiments. As shown in Table 1 below, the strength oftouch sensing signals generated due to pressing by a metal pole ismeasured in the absence of a high-resistance film material layer and inthe presence of a high-resistance film material layer with a squareresistance of 10⁸Ω/□, where, the touch sensing signals include: a touchsensing signal 1 measured at one end of the touch signal line that isnear to the control chip, and a touch sensing signal 2 measured at theother end of the touch signal line that is away from the control chip.Additionally, the strength of a noise signal without touching is furthermeasured. The measurement result is shown in Table 1 below:

TABLE 1 Touch Sensing Touch Sensing Noise Signal 1 Signal 2 SignalWithout High-Resistance 2125 2575 19 Film Material Layer WithHigh-Resistance Film 2789 3198 16 Material Layer

It may be seen from Table 1 that, the strength of the touch sensingsignal in the presence of the high-resistance film material layer ishigher than the strength of the touch sensing signal in the absence of ahigh-resistance film material layer. Further, if a touch does not occur,the strength of the noise signal in the presence of the high-resistancefilm material layer is slightly different from the strength of the noisesignal in the absence of the high-resistance film material layer, thusthe high-resistance film material layer will not influence the touchsensing performance of the touch display panel.

In embodiments of the disclosure, the static electricity dischargeperformance of the touch display panel that employs the high-resistancefilm material layer is verified by experiments. Table 2 shows the staticelectricity discharge performance of a touch display panel that employsa high-resistance film material layer with a square resistance of10⁹Ω/□:

TABLE 2 Static Voltage 8 kv −8 kv 9 kv 10 kv −10 kv −11 kv −12 kvDisplay No No No No No No No Effect color color color color color colorcolor distor- distor- distor- distor- distor- distor- distor- tion tiontion tion tion tion tion

Table 3 shows the static electricity discharge performance of a touchdisplay panel that employs a high-resistance film material layer with asquare resistance of 10⁸Ω/□:

TABLE 3 Static Voltage 8 kv −8 kv 9 kv 10 kv −10 kv −11 kv −12 kvDisplay No No No No No No No Effect color color color color color colorcolor distor- distor- distor- distor- distor- distor- distor- tion tiontion tion tion tion tion

Table 4 shows the static electricity discharge performance of a touchdisplay panel without a high-resistance film material layer:

TABLE 4 Static Voltage 8 kv −8 kv 9 kv 10 kv −10 kv −11 kv −12 kvDisplay No No No Color Color Color Color Effect color color colordistor- distor- distor- distor- distor- distor- distor- tion tion tiontion tion tion tion occurs occurs occurs occurs

It may be seen from the above Table 2, Table 3 and Table 4 that, when ahigh-resistance film material layer with a square resistance of 10⁸Ω/□or 10⁹Ω/□ is used, the touch display panel does not suffer from colordistortion even when the static electricity voltage reaches −12 KV, thusimproving the static electricity discharge performance of the touchdisplay panel. However, in the absence of the high-resistance filmmaterial layer, the touch display panel will suffer from colordistortion when the static electricity voltage reaches 10 kv.

It should be noted that the above described are embodiments of thedisclosure and the used technical principles. Those skilled in the artwill appreciate that the disclosure is not limited to the specificembodiments described herein. The various obvious alterations,readjustments and alternations may be made out without departing fromthe protection scope of the disclosure. Therefore, the disclosure hasbeen described in detail by the above embodiments, but the disclosure isnot limited to the above embodiments and also includes more otherembodiments without departing from the scope of the disclosure asdetermined by the scope of the appended claims.

Various modifications and additions can be made to the exemplaryembodiments discussed without departing from the scope of thedisclosure. For example, while the embodiments described above refer toparticular features, the scope of this disclosure also includesembodiments having different combinations of features and embodimentsthat do not include all of the described features. Accordingly, thescope of the disclosure is intended to embrace all such alternatives,modifications, and variations as fall within the scope of the claims,together with all equivalents thereof.

We claim:
 1. A touch display panel, comprising an array substrate and anopposite substrate disposed opposite to the array substrate; wherein theopposite substrate comprises a first base substrate and ahigh-resistance film material layer which is disposed on the first basesubstrate, and a square resistance of the high-resistance film materiallayer is larger than or equal to 10⁷ Ω/□ and is less than or equal to10¹² Ω/□; wherein the array substrate comprises a second base substrate,and a common electrode layer and a grounding piece which are disposed onthe second base substrate; and the high-resistance film material layeron the first base substrate is electrically connected with the commonelectrode layer or is grounded; wherein a first conductive line isdisposed between the first base substrate and the second base substrate,and the high-resistance film material layer is electrically connectedwith the common electrode layer or is grounded via the first conductiveline; and wherein the second base substrate comprises a display regionand a non-display region around the display region, a drive signalcircuit is disposed in the non-display region of the second basesubstrate, data lines and scan lines are disposed in the display regionof the second base substrate, and the data lines and/or the scan linesare electrically connected with the drive signal circuit via a bridgestructure located in the non-display region, wherein a projection of thefirst conductive line onto the second base substrate is separate from aprojection of the drive signal circuit onto the second base substrate,so that the first conductive line is insulated from the bridgestructure, or an insulating layer is disposed above the bridge structurein a light transmission direction of the touch display panel, and aprojection of the first conductive line onto the second base substrateat least partially overlaps a projection of the drive signal circuitonto the second base substrate.
 2. The touch display panel of claim 1,wherein a perimeter sealant is disposed between the opposite substrateand the array substrate, and at least a portion of the perimeter sealantis conductive to form the first conductive line.
 3. The touch displaypanel of claim 2, wherein the perimeter sealant has a frame-shapedstructure, and at least one side edge and/or at least one corner regionof the perimeter sealant is conductive.
 4. The touch display panel ofclaim 1, wherein a perimeter sealant is disposed between the oppositesubstrate and the array substrate, and a conductive silver paste isdisposed as the first conductive line on the outside of the perimetersealant.
 5. The touch display panel of claim 4, wherein the perimetersealant is made of a nonconductive material.
 6. The touch display panelof claim 4, wherein the perimeter sealant has a frame-shaped structure,and the conductive silver paste is disposed on the outside of at leastone side edge and/or at least one corner region of the perimetersealant.
 7. The touch display panel of claim 1, wherein a secondconductive line is disposed on the second base substrate, a first end ofthe second conductive line is electrically connected with the firstconductive line, and a second end of the second conductive line iselectrically connected with the common electrode layer or is grounded.8. The touch display panel of claim 7, wherein if the second end of thesecond conductive line is electrically connected with the commonelectrode layer, the second conductive line functions as a commonvoltage signal line.
 9. The touch display panel of claim 8, wherein thecommon electrode layer is located on a side of the insulating layerwhich is away from the second base substrate, and is located on the samelayer as the common voltage signal line.
 10. The touch display panel ofclaim 9, wherein the common electrode layer comprises a plurality ofcommon electrode blocks operable as touch electrodes.
 11. The touchdisplay panel of claim 7, wherein a first bonding pad is disposed on thefirst base substrate, and/or a second bonding pad is disposed on thesecond base substrate; the high-resistance film material layer iselectrically connected with the first conductive line via the firstbonding pad, and the first conductive line is electrically connectedwith the second conductive line via the second bonding pad.
 12. Thetouch display panel of claim 1, wherein the high-resistance filmmaterial layer is a black matrix doped with carbon powder on theopposite substrate, and the square resistance of the high-resistancefilm material layer is an equivalent square resistance of the blackmatrix.
 13. The touch display panel of claim 12, wherein an opticaldensity of the black matrix is larger than or equal to
 3. 14. The touchdisplay panel of claim 13, wherein a content of the carbon powder in theblack matrix and a thickness of the black matrix are configured so thatthe optical density of the black matrix is larger than or equal to 3 andthe equivalent square resistance is larger than or equal to 10⁷ Ω/□ andless than or equal to 10¹² Ω/□.
 15. The touch display panel of claim 14,wherein the thickness of the black matrix is in a range from 0.5 μm to3.5 μm.
 16. The touch display panel of claim 14, wherein the equivalentsquare resistance of the black matrix meets a formula of${R_{\Pi\; e\; 1}*\frac{L}{W}} = {R_{\Pi\; e\; 2}*\left( {\frac{l_{h\; 1}}{W - W_{h}} + \frac{L - l_{h\; 1}}{W}} \right)}$wherein R_(Πe1) denotes the equivalent square resistance of the blackmatrix, R_(Πe2) denotes an actual square resistance of the black matrix,L denotes an equivalent length of each pixel region in the black matrix,w denotes an equivalent width of each pixel region in the black matrix,l_(h1) denotes an equivalent length of a light transmission region ineach pixel region, and w_(h) denotes an equivalent width of the lighttransmission region in each pixel region.
 17. The touch display panel ofclaim 1, further comprising a flexible printed circuit board, whereinthe high-resistance film material layer and the common electrode layerare both electrically connected with a common electrode signal terminalof the flexible printed circuit board.